nuq Dev COB?

on board led Qeb qej COB led, bare Qeb cham, bare Qeb substrate interconnect pong conductive pagh QI'yaH-conductive adhesive 'ej ghIq bonding electrical connection chav wire wa'. Qeb mI' attach Hoch wo' substrate, vaj packaged nItebHa' pong silica gel, epoxy resin latlh Hap 'u' COB package, 'ay' SuD phosphor.
mIw lIng:
wa'DIch mIw COB package wafer placement lang substrate ghor pong thermal conductive epoxy yuvtlhe' (motlh DuD epoxy resin je silver particles). chutmeyvam wafer Hoch wo' substrate ghor, vaj tI' wafer lan substrate 'uchlu'chu'bogh pong tuj treatment. DevvIpghach 'oH potlh electrical connection yav wafer substrate je jojDaq cher pong wire bonding method.

COB led 'utmo' Dujvam:
ghot tu'lu'. mej 30 vatlhvI' laH toD COB chep Hal cost neH application, rewbe'mey'e' Qot led package cost, chep QuQ production costs 'ej costs secondary distribution chep, Dun significance applications semiconductor lighting promotion 'ej be'ghomDaq.
qaStaHvIS 'e' yIqaw, vegh je micro-lens molding, rational chut lulajpu'bogh laH lang Duy' webqu'meH nov 'ej wov je nIv'e' neH discrete Hal chep jan latlh flaws muDuQ QeHDaj COB chep bobcho'. Qeb Doq 'op appropriately, je laH chel 'oH chenchoH Dub chep efficiency lifetime 'ej reduce effectively bopummeH je HurDaq cri significantly.
qaStaHvIS application, lighting manufacturer production chenmoH vI'Iprup 'ej DuSaQDaq convenient 'ej reduces cost effectively COB bobcho'. qaStaHvIS production, jen jegh large-scale COB bobcho' manufacturing 'ej laH ngaq nIv'e' cham luch je.
ghaH development led lighting malja''e', HoSchoH lighting poQ tlhoS tam wabvetlh, according inquires pIm lighting applications, series COB chep Hal bobcho' MaQa' production laH lIng maH.
disadvantages COB led:
COB packaging cham bottleneck chay' Hal chep, 'ej Qap Hat reliability Dub. 'ach HochHom Qu'mey potlh malja''e' COB packaging wey mach 'ej aluminum substrate mostly lo' chaH je Hap 'u'. aluminum COB reliability 'eS because of matay'DI' thermal resistance, ngeD Hegh led jen attenuation chep pagh luH. ceramic substrate ideal COB Hap 'u', 'ach cost jen relatively, especially HoS puqvaD 2w, QatlhwI' laj pong customer.
je, COB chep Hal malja''e' poQ reH 'eS pong DaH. loQ addition standardization wanI'vammo' tlha', package manufacturers motlh nIv'e' COB led 'ej lighting laSvargh rap, vaj ghaj ghom cha' QatlhwI' neH integration.
application:
currently, 'elbogh applications COB led 'ej jatlhtaH quv, street wov wov, chaDo'maq je ngaj.


 

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